Recipients of the 2018 engineering and processing scholarships are Jenna Fowler of Oklahoma State University for processing; Lucas Morgan of University of Wisconsin – Stout for mechanical engineering; and Joshua Siegel of Rutgers University for electrical engineering.
“These students represent the potential of the next generation workforce to transform the packaging and processing industries,” says Kate Fiorianti, education manager, PMMI. “The application criteria, including the 3.0 GPA requirement and industry involvement criteria, means we truly are recognizing the best and brightest and giving them the resources to transfer academic success into professional excellence.”
Fulfilling a commitment to develop future leaders of the packaging and processing industries, the PMMI Foundation awards over $200,000 in funds - via more than 10 separate scholarships - each year to students at PMMI’s Partner Schools.
PMMI U Connection offers many opportunities to contribute to the PMMI Foundation at the upcoming PACK EXPO International and co-located Healthcare Packaging EXPO (Oct. 14–17, 2018; McCormick Place, Chicago). Proceeds from events like The Amazing Packaging Race and the all-new CareerLink @ PACK EXPO interview and networking event contribute directly to PMMI’s scholarship offerings, along with the annual PACK gives BACKTM reception hosted Monday, Oct. 15, 2018 (McCormick Place, South Building, Grand Ballroom).