Expanded educational opportunities at PACK EXPO 2016

Flexible manufacturing, productivity improvement, Internet of Things and smart packaging are among the many topics to be addressed. ​

The Innovation Stage at PACK EXPO International and Pharma EXPO 2016 (Nov. 6–9; McCormick Place, Chicago)
The Innovation Stage at PACK EXPO International and Pharma EXPO 2016 (Nov. 6–9; McCormick Place, Chicago)

The Innovation Stage at PACK EXPO International and Pharma EXPO 2016 (Nov. 6–9; McCormick Place, Chicago) is shaping up to be the largest on-floor education feature since its inception in 2012, according to show producer PMMI, The Association for Packaging and Processing Technologies.

On the PACK EXPO International side, three stages, located in the Grand Concourse, will bring together industry leaders and subject matter experts for free educational programming addressing top-of-mind issues and trends. Sessions will address topics including:

  • Internet of Things
  • Machinery safety
  • Standards & technology to improve productivity
  • Sustainability
  • Flexible manufacturing systems
  • Smart packaging
  • Contract packaging
  • Global packaging trends
  • Digital print technology
  • Multipack solutions
  • Ultrasonic technology.

All 30-minute sessions are free to attend. Check the schedule for full details. The session schedule will also be accessible through the PACK EXPO International/Pharma EXPO mobile app.

PACK EXPO International and Pharma EXPO will bring together more than 2,300 exhibitors showcasing their processing and packaging innovations to 50,000 attendees.

Learn more and register at packexpointernational.com. Registration for the show is $100 and includes admission to all exhibits and the Innovation Stage.

Learn more at PMMI.org and PACKEXPO.com and PMMIMediaGroup.com.

 

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