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OFF THE SHELF: Health-conscious food and packaging
Jim Butschli takes a look at a couple of packaging concepts from Meals to Live where the emphasis on nutrition and well being plays a huge role in shaping the packaging.
September 21, 2011
Packaging Technology: Page 345
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GE Intelligent Platforms: Flat panel computer for harsh, hazardous environments
The Wolverine III Rugged Flat Panel Computer from GE Intelligent Platforms is designed specifically to withstand harsh, hazardous conditions including dust, shock, vibration and extremes of temperature.
September 19, 2011
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Software turns 2D into 3D
VIDEO FROM GRAPH EXPO. The end-to-end solutions approach that HP featured at Graph Expo 2011 includes some pretty cool prepress software that makes it possible to turn 2D design into a 3D, on-screen image that is easily manipulated.
September 18, 2011
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Robotic corner-board placer improves end-of-line throughput
This new solution from Brenton refines workflow by having the corner boards in place before the stretch wrapping operation. This means that corner board placement does not slow down or impact the stretch wrapping process as do most, if not all, corner board placement systems.
September 16, 2011
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CMYK digital press for CPGS or converters
VIDEO FROM GRAPH EXPO. The Model 1600 PC full process color printer  from Colordyne Technologies prints at 160 ft/min in water-based inks, costs $150,000, and uses Memjet technology.
September 16, 2011
Packaging Technology
Leadership in Packaging 2011
Packaging World's 2011 Leadership in Packaging program kicked off this past January to recognize leadership and excellence among packaging machinery, materials, and services supplier; this year, 27 companies have earned the honor of Category Leader.
September 15, 2011
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Label printing done digitally
VIDEO FROM GRAPH EXPO. The Model 4830 digital UV inkjet system from EFI Jetrion is a new, affordable option for printing of colorful labels.
September 15, 2011
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Pro-face America: Compact HMI with Ethernet connectivity
The AGP4104 from Pro-face is a 3.5-in. HMI with Ethernet connectivity that simplifies the user’s option to connect to a vast selection of third party PLC’s, drives, bar code readers, and other devices.
September 14, 2011
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New blister thermoformer features modular design, high performance touch panel
September 14, 2011
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Don't miss these highlights of PACK EXPO 2011
PACK EXPO is growing steadily in Las Vegas, with more exhibitors and attendees each show. To make the most of your time at PACK EXPO, check out these new products and events.
September 14, 2011
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A new take on distributed, modular motion for packaging machinery
A new development from B&R overcomes previous limitations and contributes to modularity, machine flexibility and packaging line reconfigurability.
September 14, 2011
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Seven simple solutions for designing on-machine 'help' systems
The author has extensive experience as an electrical engineering manager in the packaging machinery industry, including the development of groundbreaking servo machines and the development of PackML-based control software.
September 14, 2011
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'Reinvigorated' OMAC Packaging Workcorp takes on New Initiatives at PACK EXPO 2011
ARC Advisory Group calls OPW ‘reinvigorated’ as new leadership takes on challenges ranging from sustainability to safety, from PackML’s role in OEE to global adoption of international standards. Key players in OPW now include some of the world’s largest pharma, CPG and food companies.
September 14, 2011
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Fiber and UV Laser Marking Systems
Matthews Marking Systems announced the expansion of its advanced laser marking portfolio.
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