Discover your next big idea in food packaging & processing this month
Experience a breakthrough in food packaging & processing—explore solutions from 2,300 suppliers spanning all industries at PACK EXPO Las Vegas.

System On Chip

Hilscher has released netX, a System On Chip for products that support industrial network connectivity. Supports as many as 4 network connections, including master and slave for Ethernet IP, Profinet, EtherCAT, Ethernet Powerlink, Sercos II, Profibus, InterBus, DeviceNet, AS-I, CC-Link, CAN, Ethernet, and Serial connections.

Pw 9600 C Hilscher

Offers a cost-effective solution for component builders to design and produce products that support the many global network standards, allowing machine builders to design for minimal engineering to comply with local network standards.

Phone: 011/49.6190.99070
www.hilscher.com

Dairy Food & Beverage Innovations Report
Discover cutting-edge packaging and processing solutions in the inaugural Packaging World/ProFood World Innovations Report. From high-speed filling machines to mono-material lids, see how the latest advancements from PACK EXPO International 2024 are driving safety, sustainability, and extended shelf life—shaping the future of dairy food and beverage packaging.
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Dairy Food & Beverage Innovations Report
List: Digitalization Companies From PACK EXPO
Looking for CPG-focused digital transformation solutions? Download our editor-curated list from PACK EXPO featuring top companies offering warehouse management, ERP, digital twin, and MES software with supply chain visibility and analytics capabilities—all tailored specifically for CPG operations.
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List: Digitalization Companies From PACK EXPO