Start 2026 at an Advantage in the Food Industry—attend PACK EXPO East!
Tackle new projects early in the year and find packaging and processing solutions for all types of foods, all in one trip to Philadelphia.
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2018
November
28
HMI: The center of the IIoT universe
Robots become more collaborative, intuitive and capable
Rugged tablet helps digitize pizza production
Seven-step cybersecurity checklist
Tripwire
Rockwell and PTC launch collaborative digital suite
Fuseneo Inc.
Amazon’s new sustainable packaging program puts the customer first
Closure Systems International
Smart packaging connects brands with their consumers
Defect removal vision system improves potato product recovery
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