Start 2026 at an Advantage in the Food Industry—attend PACK EXPO East!
Tackle new projects early in the year and find packaging and processing solutions for all types of foods, all in one trip to Philadelphia.

Leak detection for MAP packs

There was no shortage of MAP, or Modified Atmosphere Packaging, technologies at PACK EXPO International, including an impressive leak testing system for individual MAP packages that was talked about at Dansensor, a Mocon company.

Dansensor
Dansensor

LeakProtego is what this system is called. Dansensor debuted it at the IFFA tradeshow in Frankfurt, Germany, last May, and though the equipment itself was not being demonstrated at PACK EXPO, videos and discussion of it were very much a part of the Dansensor booth experience. According to Dansensor it’s a first of its kind not only because it is engineered to test for potential leaks at levels lower than previously possible but also because it lets food processors check for leaks in-line rather than further downstream after the primary packs have already been put into secondary packaging. Detecting leaks early is less labor intensive and less costly.

Shelf life solutions that work
See how processors extend product life from weeks to months using HPP, MAP, and advanced cold storage technologies.
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Shelf life solutions that work
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