See What’s Possible in Food Manufacturing at PACK EXPO International
Explore packaging & processing tech from 2,600 exhibitors & gain insights from 150+ free educational sessions—all at PACK EXPO International.
REGISTER NOW & SAVE

Weight processing module for Rockwell systems

Is easy to mount, set up, calibrate and maintain

Hardy HI 1734-WS POINT IO Series Weight Processing Module
Hardy HI 1734-WS POINT IO Series Weight Processing Module

The Hardy HI 1734-WS POINT I/O Series plug-in weight processing module is designed for Rockwell POINT I/O systems. It is configured via a Rockwell Automation Add-On-Profile (AOP) and faceplate. A replacement for analog transmitters, the module includes weightless calibration, integrated system diagnostics and mechanical vibration immunity. Rockwell adaptor products allow connectivity to EtherNet/IP, DeviceNet and ControlNet in linear, star and ring topologies.

Hot fill to aseptic: what changed at PACK EXPO
Filling speeds, seal integrity, contamination control — our editors found the liquid foods innovations that matter. See what's new and get ahead of the competition. Download your free report now. 
FREE DOWNLOAD
Hot fill to aseptic: what changed at PACK EXPO
The future of food plant maintenance is remote
Remote monitoring and access are reshaping how plants prevent downtime and protect food safety. See how.
Read More
The future of food plant maintenance is remote