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Smart machines tackle top industry challenges

Rockwell Automation shares how to improve flexibility, productivity and security with smart packaging machines.

Smart machines tackle top industry challenges
Smart machines tackle top industry challenges

Opportunities for using smart machines to address the packaging industry’s top challenges – from higher SKU counts to cybersecurity – was a reoccurring theme earlier this month at PACK EXPO International in Chicago.

Attendees learned how smart packaging machines can create more flexible operations to support shorter production runs and a wider range of products. For example, the iTRAK system with independent cart technology from Rockwell Automation uses simple software profiles in place of traditional mechanics. This allows for fast, no-tool changeovers that can occur with just the press of a button. The ability to easily reconfigure the system based on the package being run can also optimize a machine’s performance.

Attendees also saw and heard about advances in industrial IoT applications that can help boost productivity, improve uptime and reduce risk. One of those advances is scalable analytics,which structures and contextualizes data at the device, machine and enterprise levels. These analytics can leverage workers’ knowledge of a machine or process and be aligned to specific business outcomes.

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