Discover your next big idea in food packaging & processing this Sept.
Experience a breakthrough in food packaging & processing—explore solutions from 2,300 suppliers spanning all industries at PACK EXPO Las Vegas.

Toshiba debuts environmental hybrid pack for Sam's Club

Toshiba America Electronic Components Inc., Irvine, CA, uses Winterborne’s patent-pending EnviroShell™ packaging for a trio of memory storage devices introduced at Sam’s Club late last year.

Pw 10541 Toshiba Compact

EnviroShell is a hybrid blister-corrugated package made from 65% recycled materials, including 50% post-consumer content. The packaging uses a combination of corrugated to carry graphics and clear RPET (recycled polyester) to display the product. For Toshiba, an 18-ga RPET blister is sandwiched and heat-sealed between the folded E-flute corrugated; a lamination of four-color offset-printed 80# paper carries the graphics.

Construction strategies for volatile F&B markets
See how leading manufacturers are fast-tracking projects despite economic uncertainty. Get proven tactics for overcoming tariffs, labor shortages, and rising costs.
Read More
Construction strategies for volatile F&B markets
Break out of the ordinary: see what’s new in food packaging & processing
At PACK EXPO Las Vegas you’ll see machinery in action and new tech from 2,300 suppliers, collaborate with experts and explore transformative solutions. Join us this September to experience a breakthrough in food packaging and processing.
REGISTER NOW AND SAVE!
Break out of the ordinary: see what’s new in food packaging & processing