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200 degree F hot melt adhesive

PACK EXPO : National Adhesives is introducing at PackExpo a new concept in reduced-temperature packaging adhesives that the company claims will decrease maintenance requirements and downtime and increase uptime and employee safety.

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New Easy-Pac 200 degree F packaging hot melt has been developed for case and carton sealing applications in food processing, beverage, personal care, household, and consumer electronics or anything in volume that goes in a case or carton. Easy-Pac adhesive has been thoroughly tested on packaging lines around the country and has produced strong, fiber-tearing bonds in most packaging applications. Despite the low 200 degree F operating temperature, field data show that Easy-Pac maintains package security, even in the hot, dry conditions of the Arizona desert and the cold climates of northern Canada.

Hot fill to aseptic: what changed at PACK EXPO
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Hot fill to aseptic: what changed at PACK EXPO
See What’s Possible in Food Manufacturing at PACK EXPO International
Explore new machinery & materials from 2,600 exhibitors. Gain insights from 150+ free educational sessions. Find solutions to enhance quality & protect your brand at North America’s largest packaging & processing event for food, beverage & beyond.
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See What’s Possible in Food Manufacturing at PACK EXPO International