Discover your next big idea in food packaging & processing this Sept.
Experience a breakthrough in food packaging & processing—explore solutions from 2,300 suppliers spanning all industries at PACK EXPO Las Vegas.
Register Now

QComp Technologies, Inc: Robotic lid applicator

Delivering speeds up to 240 lids/min., QComp’s robotic lid applicator product line has been expanded to include a high-capacity robotic lid dispenser that uses a unique feed system to maximize production and reduce loading time.

Pw 43244 30e46b9bb83f44b788f26b8f93bdcda9

The QComp lid feed system combined with high-speed delta robots can be configured in single and dual cells. LPSX technology, now a standard option for all lid applicators, maximizes production by allowing an operator to inspect the glue patterns on the lid, without interrupting the production process. Minimizing loading time allows operators to focus less on restocking the machine and more on other tasks.

 

Fill out the form below to request more information about QComp Technologies, Inc: Robotic lid applicator
List: Digitalization Companies From PACK EXPO
Looking for CPG-focused digital transformation solutions? Download our editor-curated list from PACK EXPO featuring top companies offering warehouse management, ERP, digital twin, and MES software with supply chain visibility and analytics capabilities—all tailored specifically for CPG operations.
Download Now
List: Digitalization Companies From PACK EXPO
Break out of the ordinary: see what’s new in food packaging & processing
At PACK EXPO Las Vegas you’ll see machinery in action and new tech from 2,300 suppliers, collaborate with experts and explore transformative solutions. Join us this September to experience a breakthrough in food packaging and processing.
REGISTER NOW AND SAVE!
Break out of the ordinary: see what’s new in food packaging & processing