See new food packaging & processing solutions at PACK EXPO in Chicago
Discover new food packaging and processing innovations from 2,500+ suppliers, all under one roof at PACK EXPO International in Chicago.

It’s not edge vs. cloud—it’s both

An Automation World survey reveals both cloud and edge computing are central to IIoT-enabled predictive maintenance and performance monitoring applications, each at different stages of the journey.

Almost half of the respondents (43 percent) to a recent Automation World survey already have edge computing implementations underway.
Almost half of the respondents (43 percent) to a recent Automation World survey already have edge computing implementations underway.

In the world of the Industrial Internet of Things (IIoT), the noisy debate over cloud vs. edge computing masks a key fact: Manufacturers are mapping out a route that covers both, each an integral on-ramp for new predictive maintenance and performance monitoring applications at different stops on the journey.

Back to Basics: Understanding Conveyors for Food Processing
Discover how modern conveyors enhance food processing—boost efficiency, ensure safety, and save space. Explore the latest tech and tips to optimize your operations.
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Back to Basics: Understanding Conveyors for Food Processing
New food packaging & processing solutions, all at PACK EXPO in Chicago
Experience the cutting edge of food packaging and processing innovation at PACK EXPO International this November. See machinery and equipment in action, discover new technologies, and learn sustainable solutions from experts, all in one place.
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New food packaging & processing solutions, all at PACK EXPO in Chicago