Discover your next big idea in food packaging & processing this Sept.
Experience a breakthrough in food packaging & processing—explore solutions from 2,300 suppliers spanning all industries at PACK EXPO Las Vegas.
REGISTER TODAY & SAVE

It’s not edge vs. cloud—it’s both

An Automation World survey reveals both cloud and edge computing are central to IIoT-enabled predictive maintenance and performance monitoring applications, each at different stages of the journey.

Almost half of the respondents (43 percent) to a recent Automation World survey already have edge computing implementations underway.
Almost half of the respondents (43 percent) to a recent Automation World survey already have edge computing implementations underway.

In the world of the Industrial Internet of Things (IIoT), the noisy debate over cloud vs. edge computing masks a key fact: Manufacturers are mapping out a route that covers both, each an integral on-ramp for new predictive maintenance and performance monitoring applications at different stops on the journey.

Liquid Foods Innovations Report
Welcome to the inaugural Packaging World/ProFood World Innovations Report on liquid food packaging, drawn from nearly 300 PACK EXPO International booth visits (Chicago, Nov. 3–6, 2024). Our editors highlight the most groundbreaking equipment and materials—supported by video demos—that promise to transform how liquid foods are processed, packaged, and delivered.
Learn More
Liquid Foods Innovations Report
Researched List: Engineering Services Firms
Looking for engineering services? Our curated list features 100+ companies specializing in civil, process, structural, and electrical engineering. Many also offer construction, design, and architecture services. Download to access company names, markets served, key services, contact information, and more!
Download Now
Researched List: Engineering Services Firms