See What’s Possible in Food Packaging & Processing—Register Now & Save!
Explore tech from 2,600 exhibitors & gain insights from 150+ free educational sessions—all at North America’s largest packaging & processing event.
REGISTER NOW & SAVE

Photoelectric Laser Sensors Include Integrated IO-Link Communications

Offer superior background suppression based on Time of Flight (ToF) sensing principle

Carlo Gavazzi Ld30 Time Of Flight Photoelectric Sensors

This content was written and submitted by the supplier. It has only been modified to comply with this publication’s space and style.

Developed to operate in IO-Link environments where the sensing performance needs to be monitored and logged, Carlo Gavazzi LD30 Series photoelectric laser sensors have a sensing range up to 1,000 mm for dark or white objects. The sensors can be configured in more than a half-million combinations through the IO-Link communications. They feature a compact IP69K stainless-steel or IP67 plastic housing; two separate switching signal channels; two fully configurable independent outputs; single-point, two-point, and window modes of operation; AND, OR, XOR, and gated set reset flip-flop logic gates functionality; temperature alarms; and logging functions.


Fill out the form below to request more information about Photoelectric Laser Sensors Include Integrated IO-Link Communications
Hot fill to aseptic: what changed at PACK EXPO
Filling speeds, seal integrity, contamination control — our editors found the liquid foods innovations that matter. See what's new and get ahead of the competition. Download your free report now. 
FREE DOWNLOAD
Hot fill to aseptic: what changed at PACK EXPO
See What’s Possible in Food Manufacturing at PACK EXPO International
Explore new machinery & materials from 2,600 exhibitors. Gain insights from 150+ free educational sessions. Find solutions to enhance quality & protect your brand at North America’s largest packaging & processing event for food, beverage & beyond.
Text (32 characters max) REGISTER NOW & SAVE
See What’s Possible in Food Manufacturing at PACK EXPO International