Discover your next big idea in food packaging & processing this month
Experience a breakthrough in food packaging & processing—explore solutions from 2,300 suppliers spanning all industries at PACK EXPO Las Vegas.

End-of-Line Automation: Risk Reduction Through Digital Twin Technology

See how digital twin technology can speed design and concept level processes for risk reduction and faster machine development solutions.

Shawn Cheney, Chief Controls Engineer at Pearson Packaging Systems,
Shawn Cheney, Chief Controls Engineer at Pearson Packaging Systems,

Shawn Cheney, Chief Controls Engineer at Pearson Packaging Systems, discussed digital twin technology at today’s PACK EXPO Connects Innovation Stage. “Digital twin technology,” said Cheney, “allows us to be able to animate, simulate and emulate, to be able to achieve a risk reduction for all stakeholders involved in a project.”

Cheney said this can be done on an individual process level, on discreet equipment, or at a system level with many pieces of equipment all tied together, allowing us to accelerate through the design and concept level processes and reach a final solution much faster than is traditionally done.

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Break out of the ordinary: see what’s new in food packaging & processing
At PACK EXPO Las Vegas you’ll see machinery in action and new tech from 2,300 suppliers, collaborate with experts and explore transformative solutions. Join us this month to experience a breakthrough in food packaging and processing.
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Break out of the ordinary: see what’s new in food packaging & processing