See Delkor's Newest Case Packer Technology at PACK EXPO International 2024

Visit Booth N-5325 and experience the EVO case packer in action as it delivers high payload, reach, and speed, enhanced by Delkor's corrugated warp correction technology.

Delkor Systems

Sep 10, 2024

This content was written and submitted by the supplier. It has only been modified to comply with this publication’s space and style.

Delkor's newest case packer, EVO, offers high speeds, high payloads, and a wide range of package format capabilities. According to Delkor, this machine is faster, smaller, and smarter than anything else currently on the market.

Each cell occupies only 5' of length
Add load cells to gain speed capacity without experiencing diminishing returns
Packs lightweight products up to 20 lb. bags on the same line
Meet any packaging need from 4" wide shelf-ready displays up to 1/4 pallet stackable trays

Delkor will host live demos of its EVO Case Packer every hour during PACK EXPO International 2024 in Chicago. Visit us at Booth N-5325 for Live Demonstrations.

Delkor Systems

Videos from Delkor Systems

Bread Case Packing | Delkor's ComboPro Series Case Packer

Cartoning Machine | Trayfecta S Series Former | Paperboard Cartons

Carton Forming Machine | Trayfecta S Series Former | Small Paperboard Carton

Fill out the form below to request more information about See Delkor's Newest Case Packer Technology at PACK EXPO International 2024

Researched List: Engineering Services Firms

Liquid Foods Innovations Report

List: Digitalization Companies From PACK EXPO

New Bundler

Eastey Enterprises introduced a new shrink bundler that was bundling six-count bottles at 25/min thanks in part to B&R servo motors that provide a smooth push of bottles into film.

Unwrapper machine

New Aseptic Range Now Runs on High Speed Lines

Game-Changing Technologies Recognized at PACK EXPO Las Vegas 2025

Engineered-to-Application Sanitary, Food-grade, Liquid Mixing Systems

Liquid Foods Innovations Report

Welcome to the inaugural Packaging World/ProFood World Innovations Report on liquid food packaging, drawn from nearly 300 PACK EXPO International booth visits (Chicago, Nov. 3–6, 2024). Our editors highlight the most groundbreaking equipment and materials—supported by video demos—that promise to transform how liquid foods are processed, packaged, and delivered.

Learn More

Break out of the ordinary: see what’s new in food packaging & processing

At PACK EXPO Las Vegas you’ll see machinery in action and new tech from 2,300 suppliers, collaborate with experts and explore transformative solutions. Join us this month to experience a breakthrough in food packaging and processing.