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Expanded Ink Solutions for Product Identification and Package Coding
How to Break Non-Porous Substrate Barriers with Thermal Inkjet Coding & Marking
Aug 10, 2018
Break out of the ordinary: see what’s new in food packaging & processing
<strong>At PACK EXPO Las Vegas you’ll see machinery in action and new tech from 2,300 suppliers, collaborate with experts and explore transformative solutions. Join us this September to experience a breakthrough in food packaging and processing.</strong>
REGISTER NOW AND SAVE!
Liquid Foods Innovations Report
Welcome to the inaugural Packaging World/ProFood World Innovations Report on liquid food packaging, drawn from nearly 300 PACK EXPO International booth visits (Chicago, Nov. 3–6, 2024). Our editors highlight the most groundbreaking equipment and materials—supported by video demos—that promise to transform how liquid foods are processed, packaged, and delivered.
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