Discover your next big idea in food packaging & processing this Sept.
Experience a breakthrough in food packaging & processing—explore solutions from 2,300 suppliers spanning all industries at PACK EXPO Las Vegas.

TURCK, Inc: MEMS inclinometers

The TURCK Q42 inclinometer is a dual axis inclinometer sensor with a CANopen interface for measuring angular tilt in reference to gravity.

Pw 3131 Webturck
A MEMS  device incorporates a micro-electromechanical capacitive element into the sensor that utilizes 2 parallel plate electrodes, 1 stationary and 1 attached to a spring-mass system. Movement causes acceleration that produces deflection in the non-stationary electrode. This results in a measurable change in the capacitance between the 2 plates that is proportional to the angle of deflection. All measured values and parameters are accessible via the object directory. The micro board design in the MEMS technology provides a compact, precise inclinometer.
List: Digitalization Companies From PACK EXPO
Looking for CPG-focused digital transformation solutions? Download our editor-curated list from PACK EXPO featuring top companies offering warehouse management, ERP, digital twin, and MES software with supply chain visibility and analytics capabilities—all tailored specifically for CPG operations.
Download Now
List: Digitalization Companies From PACK EXPO
Dairy Food & Beverage Innovations Report
Discover cutting-edge packaging and processing solutions in the inaugural Packaging World/ProFood World Innovations Report. From high-speed filling machines to mono-material lids, see how the latest advancements from PACK EXPO International 2024 are driving safety, sustainability, and extended shelf life—shaping the future of dairy food and beverage packaging.
Access Now
Dairy Food & Beverage Innovations Report