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Discussing issues, breaking new ground

Editorials usually fall into one of two categories: Either they're "outside" and discuss the overall business and examine trends that may have an impact on your jobs; or they're "inside," and they explain how the magazine, especially a particular issue, has been created to help you.

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This editorial won't be that usual "we are improved" tub-thumping. But our September issue toppled a few idols, and I think it's important that we point them out--and explain them--to you.

First, the September issue marked Dave Newcorn's shift from senior editor/special projects editor to director of new media for Packaging World. On behalf of all the PW editors, Dave takes both our best wishes and our cooperation, although we'll miss his editorial work ethic and his ideas.

In his new job, Dave can now devote full time to implementing his ideas about how our Web site can best serve the packaging community. In the past, Dave's special projects editor title addendum recognized his past contributions to the Web site and to the creation and continuing impact of our Controls & Integration special sections four times each year. Especially for those readers who are involved in systems integration, Dave will serve as moderator Oct. 18 and 19 for the Line Integration sessions at Solutions 99, the conference program to be held at Pack Expo Las Vegas.

Last month, Dave took his "tilting at windmills" act to a new level. In the Controls & Integration section, Dave developed a report on the controversy between personal computers (PCs) and programmable logic controllers (PLCs) for dominance as the vehicle to control machine function. While this is an interesting topic among the real techies of our business, Dave took it back one step--and that's been a big step for PW. Dave's report, as well as the inside cover of the special section, featured engineers--but not those at packaging companies. Rather, the engineers whom Dave interviewed and reported on were engineers at the companies that make packaging equipment!

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Break out of the ordinary: see what’s new in food packaging & processing
Liquid Foods Innovations Report
Welcome to the inaugural Packaging World/ProFood World Innovations Report on liquid food packaging, drawn from nearly 300 PACK EXPO International booth visits (Chicago, Nov. 3–6, 2024). Our editors highlight the most groundbreaking equipment and materials—supported by video demos—that promise to transform how liquid foods are processed, packaged, and delivered.
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Liquid Foods Innovations Report