Design competition / intl. trade fairs

iF Intl. Forum Design GmbH will present the “iF Packaging Award” at interpack (www.interpack.com) Process and Packaging 2008, organized by Messe Düsseldorf North America, April 24-30, 2008 in Düsseldorf, Germany.

Oct 3, 2007

Deadline for entry submission is December 15, 2007. Visit www.ifdesign.de for more information.

At Pack Expo Las Vegas 2007, Messe Düsseldorf North America will promote three international trade fairs for the packaging industry: interpack Process and Packaging 2008, Upakovka 2008, and Brasilpack 2008.

Visit www.mdna.com for more details.

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Design competition / intl. trade fairs

Hot fill to aseptic: what changed at PACK EXPO

Discover Leading Suppliers

The packaging innovations from PACK EXPO worth your attention.

How Ammonia, CO₂, and Nitrogen Are Reshaping Food & Beverage Cooling

Practical Wins from Digital Transformation

End of the Line Video Series: Spee-Dee's Digital Dennis Update, Progress in Industrial Compostability, and Other AI News

Processing News Roundup May 2026: FDA Food Safety Priorities, Top Trends at interpack, Royal Avebe Electrifies

PMMI Launches New CPG NexGen Awards to Celebrate the Future Leaders of Packaging and Processing

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