ProFood Tech 2017

Jul 31, 2016
Siemens White Paper
April 4 - 6, 2017
ProFood Tech
McCormick Place, Chicago, IL – THE Food & Beverage Processing Event. Powered by tradeshow leaders PACK EXPO, Anuga and the International Dairy Foods Association (IDFA)––brings together the biggest names in the industry to define a new era in processing.
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Discover Leading Suppliers
Recommended
Discover Leading Suppliers
The packaging innovations from PACK EXPO worth your attention.
Recommended
The packaging innovations from PACK EXPO worth your attention.
Hot fill to aseptic: what changed at PACK EXPO
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Hot fill to aseptic: what changed at PACK EXPO
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Hot fill to aseptic: what changed at PACK EXPO
Filling speeds, seal integrity, contamination control — our editors found the liquid foods innovations that matter. See what's new and get ahead of the competition. Download your free report now. 
FREE DOWNLOAD
Hot fill to aseptic: what changed at PACK EXPO
Products
Harpak-ULMA's VTC 840 WD
Washdown Vertical Form-Fill-Seal Platform
Harpak-ULMA's VTC 840 WD combines 360° IP66 sanitation, lower electrical and compressed-air consumption, and intelligent operator assistance to cut utility use and simplify operator training.
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