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ProFood Tech 2017

Jul 31, 2016
Siemens White Paper
April 4 - 6, 2017
ProFood Tech
McCormick Place, Chicago, IL – THE Food & Beverage Processing Event. Powered by tradeshow leaders PACK EXPO, Anuga and the International Dairy Foods Association (IDFA)––brings together the biggest names in the industry to define a new era in processing.
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How Can You Honor a Leader?
Induction into the Packaging & Processing Hall of Fame is the highest honor in our industry. Submit your leader to be considered for the Class of 2024 now through June 10th. New members will be inducted at PACK EXPO International in Chicago.
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