While the Committee will meet in person at SuperCorr, sponsored by the Technical Assn. of the Pulp & Paper Industry, in Atlanta on Tuesday, Nov. 9, individuals attending Pack Expo in Chicago have two ways to participate in the committee meeting.
For those in Chicago for Pack Expo a conference-call phone link can be established by calling 877/512-0941, using the last four digits, 0941, as the participant code. The meeting begins at 10 a.m. in Chicago. For those who wish to participate via a computer using a Virtual Classroom with visuals can link via this address. To enter the classroom, a participant may need the following key (UCG7J469L) to enter. It also may help, says committee chair Andy Kerr of Eastman Kodak to test this system by using the following link: hpe-learning.com/testsetup.
