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Intelligent and Smart Packaging set for January

IDTechEx and Pira Intl. bring the Intelligent and Smart Packaging USA conference to Las Vegas, NV, Jan. 27-28, 2004. The companies say it is the world’s largest on the subject, with speakers from Nestlé US, The Swedish Post Office, AstraZeneca Italy, Marks & Spencer UK, and the U.S.

Army. Packaging World and Packworld.com are official media partners for the event.

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The building envelope is a production asset