Discover your next big idea in food packaging & processing this Sept.
Experience a breakthrough in food packaging & processing—explore solutions from 2,300 suppliers spanning all industries at PACK EXPO Las Vegas.
REGISTER TODAY & SAVE

GE Intelligent Platforms: Flat panel computer for harsh, hazardous environments

The Wolverine III Rugged Flat Panel Computer from GE Intelligent Platforms is designed specifically to withstand harsh, hazardous conditions including dust, shock, vibration and extremes of temperature.

Pw 29958 Webgeintel
The computer’s resistive 15-in. antiglare, scratch-resistant touchscreen is readable even in direct sunlight.  Its rugged design enables it to operate within a temperature range of -20° to +60°C as standard and to withstand extreme shock and vibration.  Its low weight of 22.5 lbs. makes it easy to install and safe and convenient to transport. The computing platform is a COM Express module and carrier board designed specifically for the Wolverine III.  At the heart of the COM Express module is an Intel® Core™2 Duo 2.26GHz processor.
Food safety excellence on a budget: The smart approach
When material costs rise and margins shrink, efficient cleaning becomes critical. Learn cost-effective sanitation strategies that enhance food safety while reducing resource consumption.
Read More
Food safety excellence on a budget: The smart approach
Proteins Innovations Report
Discover cutting-edge protein packaging innovations from PACK EXPO International 2024! Our editorial team spotlights hygienic equipment and materials designed for the demanding protein sector. From IP66-rated washdown systems and all-servo chub packaging to advanced auto-bagging technology and compostable trays replacing EPS, this report reveals how manufacturers are addressing clean, safe design while improving efficiency.
Take Me There
Proteins Innovations Report