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Schneider Electric Unveils IIoT-Ready PLCs, AR, and Motion
Demos of IIoT box as server for hands-free augmented reality and next-generation of motor controls.
Sep 26, 2019
Liquid Foods Innovations Report
Welcome to the inaugural Packaging World/ProFood World Innovations Report on liquid food packaging, drawn from nearly 300 PACK EXPO International booth visits (Chicago, Nov. 3–6, 2024). Our editors highlight the most groundbreaking equipment and materials—supported by video demos—that promise to transform how liquid foods are processed, packaged, and delivered.
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List: Digitalization Companies From PACK EXPO
Looking for CPG-focused digital transformation solutions? Download our editor-curated list from PACK EXPO featuring top companies offering warehouse management, ERP, digital twin, and MES software with supply chain visibility and analytics capabilities—all tailored specifically for CPG operations.
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