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Sold-out OMAC pavilion allows ISA to offer free admission to June technical conference for all.

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The Instrument Society of America has announced free admission to both ISA and OMAC Plug-and-Pack Workgroup conference sessions at this year’s ISA Process Control Conference in Valley Forge Pennsylvania June 5-6 2003.

The OMAC Plug-and-Pack Workgroup and ISA Food & Pharma Division are holding the first OMAC Conference track at an ISA event to promote common standards technologies and methods for effective processing and packaging automation.

Thanks to exceptionally strong exhibit sales spurred by OMAC member companies ISA met its financial goals and is therefore able to rebate the cost of conference admissions which are used to defray the cost of their educational programs.

“The strong exhibitor interest in this our first venture together bodes well for future cooperative efforts between ISA and OMAC Users Group” stated OMAC executive director Keith Campbell of Louisiana Center for Manufacturing Sciences. “This is a nonmember savings of $475 for both days. I encourage as many PCC visitors as possible to take advantage of this unusual opportunity.”

A review of the ISA and Plug-and-Pack conference tracks (www.isa.org) will reveal notable synergies between the two disciplines. For example OMAC’s PackML guideline has strong links to ISA S95 and World Batch Forum state models. Conference topics will include S95 S88 guidelines for control technologies business justifications for automation current Good Manufacturing Practices for FDA compliance integration of Manufacturing Execution Systems with automation and a tutorial on IEC 61131-3 programming.

The Valley Forge location will also be the venue for the spring Plug-and-Pack Workgroup meeting. The next scheduled meeting will be at Pack Expo 2003.

For information please visit www.omac.org. Or contact Keith Campbell Executive Director telephone 717/838-5511 or email [email protected].

[This advertorial originally appeared in Packworld.com's supplier-sponsored content area.]

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