See What’s Possible in Food Manufacturing at PACK EXPO International
Explore packaging & processing tech from 2,600 exhibitors & gain insights from 150+ free educational sessions—all at PACK EXPO International.
REGISTER NOW & SAVE

Create a free ProFood World account to continue reading

EtherCAT solution for direct power supply

A range of systems and components are available.

Beckhoff EtherCAT P I/O solution
Beckhoff EtherCAT P I/O solution

The Beckhoff EtherCAT P I/O solution enables direct power supply for EtherCAT P slaves and the connected sensors and actuators; the power supply from the unit is rated at 2x 24VDC/3A. The solution is engineered for connecting small remote I/O stations in terminal boxes and for centralized I/O components located throughout the process. A range of EtherCAT P systems and I/O components in protection class IP67 is available.

 
See What’s Possible in Food Manufacturing at PACK EXPO International
Explore new machinery & materials from 2,600 exhibitors. Gain insights from 150+ free educational sessions. Find solutions to enhance quality & protect your brand at North America’s largest packaging & processing event for food, beverage & beyond.
Text (32 characters max) REGISTER NOW & SAVE
See What’s Possible in Food Manufacturing at PACK EXPO International
Hot fill to aseptic: what changed at PACK EXPO
Filling speeds, seal integrity, contamination control — our editors found the liquid foods innovations that matter. See what's new and get ahead of the competition. Download your free report now. 
FREE DOWNLOAD
Hot fill to aseptic: what changed at PACK EXPO