See new food packaging & processing solutions at PACK EXPO in Chicago
Discover new food packaging and processing innovations from 2,500+ suppliers, all under one roof at PACK EXPO International in Chicago.

New Area Camera Models

Nine new models have been added to the Teledyne Dalsa Genie Nano series.

Pfw 1263 1512np Teledynedalsa

Built around ON Semiconductor's Python CMOS image sensors, the units deliver fast frame rates in a small, robust body, and are suitable for multiple vision applications. The cameras are available in three resolutions, including 640 x 480 (running up to 850 frames per second in VGA), 800 x 600 and 1280 x 1024 pixels, in monochrome, color and near infrared (NIR). Key features include TurboDrive for fast frame rates and full image quality; trigger-to-Image-Reliability for easy system control and debugging; small footprint for tight spaces - 44 mm x 29 mm x 21 mm; temperature range of -20 to 60 °C; two inputs/two opto-coupled outputs for easy integration and deployment; and weight of only 46 grams. Suggested applications include intelligent traffic systems, entertainment, medical, food and beverage inspection, and electronics and printed circuit board inspection.

New food packaging & processing solutions, all at PACK EXPO in Chicago
Experience the cutting edge of food packaging and processing innovation at PACK EXPO International this November. See machinery and equipment in action, discover new technologies, and learn sustainable solutions from experts, all in one place.
Read More
New food packaging & processing solutions, all at PACK EXPO in Chicago
Back to Basics: Understanding Conveyors for Food Processing
Discover how modern conveyors enhance food processing—boost efficiency, ensure safety, and save space. Explore the latest tech and tips to optimize your operations.
Read More
Back to Basics: Understanding Conveyors for Food Processing