See What’s Possible in Food Manufacturing at PACK EXPO International
Explore packaging & processing tech from 2,600 exhibitors & gain insights from 150+ free educational sessions—all at PACK EXPO International.
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Multi-laminate structures feature unique adhesives

Offer low solvent residue and high bond strengths

Toyo Ink America adhesive
Toyo Ink America adhesive

Toyo Ink America high-barrier packaging solutions include TOMOFLEX polyester-type, two-component adhesives designed for the lamination of plastic films to flexible films and aluminum foil. Resistant to acidic foods, the solvent-based TOMOFLEX TM-250HV-US adhesive is formulated for high-temperature retort-pouch processing up to 135°C.

Hot fill to aseptic: what changed at PACK EXPO
Filling speeds, seal integrity, contamination control — our editors found the liquid foods innovations that matter. See what's new and get ahead of the competition. Download your free report now. 
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Hot fill to aseptic: what changed at PACK EXPO
See What’s Possible in Food Manufacturing at PACK EXPO International
Explore new machinery & materials from 2,600 exhibitors. Gain insights from 150+ free educational sessions. Find solutions to enhance quality & protect your brand at North America’s largest packaging & processing event for food, beverage & beyond.
Text (32 characters max) REGISTER NOW & SAVE
See What’s Possible in Food Manufacturing at PACK EXPO International