See new food packaging & processing solutions at PACK EXPO in Chicago
Discover new food packaging and processing innovations from 2,500+ suppliers, all under one roof at PACK EXPO International in Chicago.

Multi-laminate structures feature unique adhesives

Offer low solvent residue and high bond strengths

Toyo Ink America adhesive
Toyo Ink America adhesive

Toyo Ink America high-barrier packaging solutions include TOMOFLEX polyester-type, two-component adhesives designed for the lamination of plastic films to flexible films and aluminum foil. Resistant to acidic foods, the solvent-based TOMOFLEX TM-250HV-US adhesive is formulated for high-temperature retort-pouch processing up to 135°C.

Special Report: Essential tools for effective sanitation
Today’s food processors are faced with an ongoing labor shortage and pressure to increase production to meet market demands. That means less downtime for cleaning while adhering to strict food safety guidelines. How can a manufacturer overcome these hurdles to stay profitable?
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Special Report: Essential tools for effective sanitation