See Hewlett-Packard technology in action at Pack Expo

Be sure to visit the H-P OEM partners at PACK EXPO International. They'll beat McCormick Place to demonstrate how H-P Thermal Ink Jet Technology canprovide exciting solutions for your package coding needs.

Pw 12679 Guide

During your trip to this year's PACK EXPO International be sure to visit Hewlett-Packard's OEM partners. They'll be at McCormick Place to demonstrate how HP Thermal Ink Jet Technology can provide exciting solutions for your packaging coding needs.

Receive a free Chicago restaurant guide when you stop by any of the following booths:

AT Information Products Booth #N-3404

Collins Ink Corp. Booth #N-5240

Digital Design Booth #S-2807

Nutec Systems Booth #S-1525 #M-22

Prism Inc. Booth #N-4738

RSI Print Systems Booth #E-7466

The restaurant guide is published by Packaging World and sponsored by Hewlett-Packard. This handy reference features the best Chicago has to offer.

For a free copy of the restaurant guide email your request to [email protected] or visit www.hp.com/oeminkjet.

Hot fill to aseptic: what changed at PACK EXPO
Filling speeds, seal integrity, contamination control — our editors found the liquid foods innovations that matter. See what's new and get ahead of the competition. Download your free report now. 
FREE DOWNLOAD
Hot fill to aseptic: what changed at PACK EXPO
The future of food plant maintenance is remote
Remote monitoring and access are reshaping how plants prevent downtime and protect food safety. See how.
Read More
The future of food plant maintenance is remote