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PMMI Foundation Honors Six Students with $5,000 PACK EXPO Scholarships

Supported by the PACK gives BACK events, the PMMI Foundation awards six promising students each a $5,000 PACK EXPO scholarship to support their academic and career development in the packaging and processing industry.

Pelv 2025

The PMMI Foundation, the charitable arm of PMMI, The Association for Packaging and Processing Technologies, proudly announces the recipients of the 2025 PACK EXPO scholarships. This year, six promising students from U.S. colleges and universities have each been awarded a $5,000 scholarship to support their academic pursuits and career development in the packaging and processing industry.

The scholarships, made possible through the PACK gives BACK™ events at PACK EXPO International and PACK EXPO Las Vegas, are part of PMMI’s commitment to investing in the future workforce.

“Supporting the next generation of industry leaders is central to our mission,” says Jim Pittas, president and CEO, PMMI. “Thanks to the incredible support of our sponsors and partners, we can continue to provide resources that inspire innovation and growth in the packaging and processing sectors. We extend our gratitude to everyone who contributes to this initiative.”

Each year, the PMMI Foundation awards over $200,000 in scholarships to students pursuing careers in fields such as packaging, food processing, engineering, and mechatronics. To date, the Foundation has awarded over $6 million to strengthen the future workforce, demonstrating its ongoing commitment to fostering industry talent.

To be eligible for the $5,000 scholarship, students must demonstrate academic excellence, major in engineering, packaging, processing, mechatronics, or a related field, and strongly commit to advancing the industry.

Congratulations to the 2025 PACK EXPO Scholarship recipients:

  • Morgan Bartholomew, Pennsylvania College of Technology – Polymer & Plastics Engineering
  • Amy Foo, California Polytechnic State University, San Luis Obispo – Industrial Technology and Packaging
  • Matthias Fowler, Hennepin Technical College – Mechatronics
  • Madison Roberts, Michigan State University – Packaging Science
  • Ethan Sawyer, Tennessee Technological University – Mechanical Engineering
  • Blake Strickland, Cape Fear Community College – Industrial Engineering Technology

For more information about the PMMI Foundation and its scholarship programs, visit pmmifoundation.org/scholarships.

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