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ALL-CON World Systems Inc: Hot melt glue system

ALL-CON World Systems (Seaford, DE) introduces its new hot melt glue conveying system. The automated, stand-alone materials handling system conveys a consistent flow of thermoplastic adhesives to hot melt glue melters.

Patented, proprietary system can transport either pellets or chiclet-sized adhesive chips a distance of more than 100’ from a bulk source to a melter unit. Machine is designed to feed either single or multiple glue stations. Company recommends use of this system for adhesive pellets with a melt temperature above 280?F.

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Liquid Foods Innovations Report
Welcome to the inaugural Packaging World/ProFood World Innovations Report on liquid food packaging, drawn from nearly 300 PACK EXPO International booth visits (Chicago, Nov. 3–6, 2024). Our editors highlight the most groundbreaking equipment and materials—supported by video demos—that promise to transform how liquid foods are processed, packaged, and delivered.
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