Embedded PC features convenience and efficiency

Can serve as cost-effective, standalone controller

Beckhoff CX7000 embedded PC
Beckhoff CX7000 embedded PC
Liquid Foods Innovations Report
Welcome to the inaugural Packaging World/ProFood World Innovations Report on liquid food packaging, drawn from nearly 300 PACK EXPO International booth visits (Chicago, Nov. 3–6, 2024). Our editors highlight the most groundbreaking equipment and materials—supported by video demos—that promise to transform how liquid foods are processed, packaged, and delivered.
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Liquid Foods Innovations Report