Package Testing System Offers Shorter Fill and Test Times

Designed for use on the production floor or in the laboratory, the Dansensor Lippke package testing system can measure package leaks, burst pressure, and seal strength in all types of packages, with or without a modified atmosphere. The 5000 package integrity testing system includes a test head with the sensor probe located inside the needle for more accurate pressure control during the testing process. The touchscreen has a user-friendly graphical user interface that enables intuitive data capturing, storage, and export. The system supports a range of standard test methods, including ASTM F-1140, ASTM F-2054, ASTM F-2095, ASTM F-2096, ISO 11607, and enables compliance to 21 CFR, part 11 for data security.